发明名称 基板処理装置、基板処理装置制御プログラム、及び半導体装置の製造方法
摘要 A substrate processing apparatus includes a mounting stand, a cover opening and closing unit, a substrate checking unit, a substrate transfer mechanism, a substrate processing unit, and a controller. While the substrate processing unit is processing a substrate within a first substrate accommodation container mounted on the mounting stand, when a second substrate accommodation container is mounted on the mounting stand, the controller provides control to open the cover of a second substrate accommodation container and check a substrate within the second substrate accommodation container by means of the substrate checking unit, and when the substrate checking is terminated, the controller provides control to close the cover of the second substrate accommodation container.
申请公布号 JP5901978(B2) 申请公布日期 2016.04.13
申请号 JP20120008958 申请日期 2012.01.19
申请人 株式会社日立国際電気 发明人 白川 真人
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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