| 摘要 |
In this metal defect detection method, a metal sample is disposed with the inspection surface thereof facing up, an etching liquid is held on the inspection surface such that the whole inspection surface is covered with the etching liquid, and a defect is made to appear, then, in a state wherein the thickness of the etching liquid on the inspection surface is more than 0 mm but equal to or less than 10 mm, an image of the inspection surface is picked up by means of an image pickup apparatus. |
