| 摘要 |
This roughened copper foil is provided with a roughened surface having a fine uneven surface structure formed on both surfaces of a copper foil by needle-like or plate-like protrusions having a maximum length of 500 nm, and comprises a copper composite compound containing copper oxide. One surface of the copper foil is a laser-irradiated surface that has been irradiated by laser light during laser processing, while the other surface is an adhesion surface that adheres with an insulation layer construction material. The roughened copper foil for laser drilling is suitable for the formation of a buildup layer of a printed wiring board, and forms a high quality multilayer printed wiring board. |
