An LED unit (100) includes a base unit (1). The LED unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having LED chips, the light emitting device being placed on a front surface of the base unit. The base unit is fonned of a molding in which a metal member (11) is covered with thermally conductive resin having an electrical insulation property, and the thermally conductive resin is interposed between the light emitting device and the metal member. The LED unit can thus efficiently radiate heat generated in the light emitting device through the base unit toward a fixture to which the LED unit is attached.
