发明名称 発光装置、および照明装置
摘要 The light emission device (1a) includes an insulating substrate (2) and a light-emitting section (5) which is provided on a main surface of the insulating substrate (2) and has an LED chip (3) and a wiring pattern (4). In an edge area of the main surface of the insulating substrate (2), a wall pattern (7a) made of an insulating material is provided so as to surround the light-emitting section (5).
申请公布号 JP5902301(B2) 申请公布日期 2016.04.13
申请号 JP20140524694 申请日期 2013.06.10
申请人 シャープ株式会社 发明人 本間 優太;英賀谷 誠;幡 俊雄;名田 智一
分类号 H01L33/48;F21K9/00;F21S2/00;F21V19/00;F21V23/00;F21V29/00;H01L23/12;H01L23/28 主分类号 H01L33/48
代理机构 代理人
主权项
地址