Chemical mechanical polishing method and apparatus

摘要

Methods for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool including a polish pad and a pad resurfacing arm which includes a pad cleaning part, a pad conditioning part, and a slurry dispensing part, dispensing a slurry to the polish pad utilizing the pad resurfacing arm, and polishing the semiconductor wafer utilizing the polish pad.

主权项

1. A method comprising:
providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool comprising:
a polish pad, anda pad resurfacing arm having a cylindrical or conical shape with a length extending from an outer periphery of the polish pad and across a center of the polish pad, the pad resurfacing arm comprising:
a pad cleaning part,a pad conditioning part, anda slurry dispensing part; dispensing a slurry to the polish pad utilizing the pad resurfacing arm; and polishing the semiconductor wafer utilizing the polish pad by rotating the pad resurfacing arm.