Power connection structure of driver IC chip

摘要

A power connection structure of a driver IC chip including a first power terminal unit formed on one side thereof, a second power terminal unit formed on the other side thereof, and a dummy power terminal unit formed between the first power terminal unit and the second power terminal unit. The driver IC chip is mounted to a liquid crystal panel of a liquid crystal display device in a chip-on-glass (COG) type. Both of the first power terminal unit and the dummy power terminal unit and both of the dummy power terminal unit and the second power terminal unit are connected through routing lines in the driver IC chip.

主权项

1. A power connection structure of a driver integrated circuit chip, the driver integrated circuit chip comprising:
a chip-on-glass type mounting to a display panel of a display device; a first side; a second side opposite the first side along a transverse length; a first power terminal unit disposed within the driver integrated circuit chip adjacent the first side; a second power terminal unit disposed within the driver integrated circuit chip adjacent the second side and spaced from the first power terminal unit; a dummy power terminal unit disposed within the driver integrated circuit chip between the first power terminal unit and the second power terminal unit; and a plurality of routing lines extending between the first power terminal unit and the dummy power terminal unit and extending between the second power terminal unit and the dummy terminal unit, the plurality of routing lines disposed completely within the driver integrated circuit chip, wherein the first power terminal unit is directly connected to the dummy power terminal unit through at least one of the plurality of routing lines, and the second power terminal unit is directly connected to the dummy power terminal unit through at least one of the plurality of routing lines.