发明名称 |
Single chip scanning lidar and method of producing the same |
摘要 |
A chip-scale scanning lidar includes a two dimensional (2D) scanning micromirror for a transmit beam and a 2D scanning micromirror for a receive beam, a laser diode and a photodetector, a first waveguide and first grating outcoupler coupled to a front facet of the laser diode, a second waveguide and a second grating outcoupler coupled to a rear facet of the laser diode on a substrate. A first fixed micromirror, a second micromirror, a third micromirror, and a focusing component are in a dielectric layer bonded to the substrate over the laser diode and photodetector. The photodetector is optically coupled to the second fixed micromirror and the third fixed micromirror for coherent detection. |
申请公布号 |
US9310471(B2) |
申请公布日期 |
2016.04.12 |
申请号 |
US201414317695 |
申请日期 |
2014.06.27 |
申请人 |
HRL Laboratories, LLC |
发明人 |
Sayyah Keyvan;Patterson Pamela R.;Efimov Oleg M. |
分类号 |
G01C3/08;G01S7/481;H01S5/026;H01S5/02;H01S5/12;G01S17/02 |
主分类号 |
G01C3/08 |
代理机构 |
Ladas & Parry |
代理人 |
Ladas & Parry |
主权项 |
1. A method of fabricating a chip-scale scanning lidar comprising:
forming a two dimensional (2D) scanning micromirror for a transmit beam on a substrate; forming a two dimensional (2D) scanning micromirror for a receive beam on the substrate; forming a laser diode on the substrate; forming a photodetector on the substrate; forming a first waveguide on the substrate connected on one end of the first waveguide to a first facet of the laser diode; forming a first grating outcoupler on the substrate connected to another end of the first waveguide; forming a second waveguide on the substrate connected on one end of the second waveguide to a second facet of the laser diode; forming a second grating outcoupler on the substrate connected to another end of the second waveguide; forming a first fixed micromirror and a second fixed micromirror in a first dielectric layer; forming a third fixed micromirror in a second dielectric layer; forming a focusing component in a third dielectric layer; bonding the first, second and third dielectric layers together to form a composite structure; aligning the composite structure to the substrate over the laser diode and photodetector; and bonding the composite structure to the substrate over the laser diode and photodetector. |
地址 |
Malibu CA US |