| 发明名称 | Housing assembly | ||
| 摘要 | A method including bending an electronic apparatus housing member, where the housing member is a substantially rigid one-piece member, where the bending comprises a bending jig bending the housing member from a first shape to a second shape, where the bending elastically bends the housing member to form an electronic component path of insertion into the housing member through a front aperture of the housing member, where a shape of the front aperture is changed by the bending; inserting an electronic component assembly as a singular module into the housing member through the path; and allowing the housing member to resiliently deflect back to the first shape, where the housing member substantially closes the path. | ||
| 申请公布号 | US9312906(B2) | 申请公布日期 | 2016.04.12 |
| 申请号 | US201414171013 | 申请日期 | 2014.02.03 |
| 申请人 | HERE Global B.V. | 发明人 | Kujala Pertti Kalevi |
| 分类号 | H04M1/00;H04B1/3888;B22C9/00 | 主分类号 | H04M1/00 |
| 代理机构 | Lempia Summerfield Katz LLC | 代理人 | Lempia Summerfield Katz LLC |
| 主权项 | 1. A method comprising: bending an electronic apparatus housing member, where the housing member is a substantially rigid one-piece member, where the bending comprises a bending jig bending the housing member from a first shape to a second shape, where the bending elastically bends the housing member to form an electronic component path of insertion into the housing member through a front aperture of the housing member, where a shape of the front aperture is changed by the bending; inserting an electronic component assembly as a singular module into the housing member through the path; and allowing the housing member to resiliently deflect back to the first shape to prevent the electronic component assembly from exiting the front aperture. | ||
| 地址 | Veldhoven NL | ||