Electronic device and noise suppression method

摘要

A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.

主权项

1. An electronic device comprising:
a first interconnect substrate including a first conductor; a second interconnect substrate connected to the first interconnect substrate, including a second conductor of which at least a portion is formed in a region opposite the first conductor, the second conductor forming a repeated structure of conductors, and the second conductor being electrically isolated from other conductors included in the second interconnect substrate; a socket including a connection portion that is formed on the first conductor of the first interconnect substrate, and includes an insertion portion; and a connecting member that is formed on the second conductor of the second interconnect substrate, and inserted into the insertion portion, wherein the first conductor comprises a portion of an electromagnetic band gap (EBG) structure and the second conductor comprises a portion of the EBG structure, and wherein the second interconnect substrate comprises a package interconnect substrate.