| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that it is difficult to form multiple air vents or a large air vent on a lateral face where outer leads thicken thereby to provide the potential for failure in filling and generation of voids, which are caused by insufficient air vent, and encapsulation resin does not flow on an upper layer and a lower layer of a substrate in a balanced manner during resin encapsulation thereby to cause failure infilling and generation of voids.SOLUTION: A semiconductor device 100 where a heat sink 1 and a substrate 2 are arranged next to each other in a short direction of a resin sealed body 3 is manufactured by a manufacturing method which comprises the steps of: arranging an air vent 4 on a lateral face on a short side of the resin sealed body 3 at the time of resin sealing; and arranging a gate 5 on a lateral face on a long side of the resin sealed body 3 and away from the air vent 4.SELECTED DRAWING: Figure 1 |
