发明名称 SHEET BONDING APPARATUS AND SHEET BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sheet bonding apparatus which feeds an adhesive sheet to a predetermined position of a holding surface, and to provide a bonding method.SOLUTION: A sheet bonding apparatus 10 includes: feeding means 20 configured to feed an adhesive sheet AS; gas spray means 30 configured to spray a gas to the adhesive sheet AS; and bonding means 40 having a holding surface 43 which holds the adhesive sheet AS from the held surface AS1 side of the adhesive sheet AS fed by the feeding means 20 and pressing the adhesive sheet AS to an adherend WK to bond the adhesive sheet thereto. The gas spray means 30 includes first spray means 31 which sprays a gas GS1 along a feeding direction of the adhesive sheet AS to the held surface AS1 side of the fed adhesive sheet AS.SELECTED DRAWING: Figure 1
申请公布号 JP2016050034(A) 申请公布日期 2016.04.11
申请号 JP20140178064 申请日期 2014.09.02
申请人 LINTEC CORP 发明人 OZAWA KAZUYA
分类号 B65C9/28;B65C9/36;H01L21/683 主分类号 B65C9/28
代理机构 代理人
主权项
地址