| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit component capable of suppressing the lowering of bond quality, for the joint part of a lead frame and a connector terminal.SOLUTION: An electronic circuit component includes a plurality of connector terminals 3 formed separately from a lead frame 1, a conductive joints 4 formed at the lead side joint end 11 of the lead frame 1 and the connector side joint end 33 of the connector terminal 3, and joining the lead frame 1 and plurality of connector terminals 3, and a resin member 2 covering a part of the lead frame 1 and a part of the plurality of connector terminals 3 integrally, fixing the lead frame 1 by a circuit pattern and fixing the positions of the plurality of connector terminals 3 for the lead frame 1. An opening 21 for exposing the lead side joint end 11, connector side joint end 33 and conductive joint 4 is formed in the resin member 2.SELECTED DRAWING: Figure 1 |
