发明名称 |
COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND LAMINATE, AND METHODS FOR MANUFACTURING COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide copper foil with carrier in which the variation in carrier peel strength between before and after heat pressing of the copper foil with carrier is well suppressed.SOLUTION: Provided is copper foil with carrier having a carrier, an intermediate layer, and an ultra-thin copper layer in this order, and in which the peel strength of the carrier after heat pressing of the copper foil with carrier under the condition of a pressure: 20 kgf/cmand 220°C for 2 hours, is 150% or less of the peel strength before the heat pressing, and the peel strength of the carrier after the heat pressing under the condition of a pressure: 20 kgf/cmand 220°C for 2 hours, is 2 N/m or more and 30 N/m or less.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016050364(A) |
申请公布日期 |
2016.04.11 |
申请号 |
JP20150171436 |
申请日期 |
2015.08.31 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
NAGAURA YUTA |
分类号 |
C25D1/04;B32B15/08;C25D1/20;C25D5/50;H05K1/09;H05K3/20 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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