发明名称 |
PACKAGE OF ELECTRIC ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a package of an electric element which enables reduction of the size and thickness of the package, reduction of power consumption and displacement caused by temperature regulation of the package, stably conducts optical input/output in between the interior and exterior of the package with high reliability, and needs the temperature regulation.SOLUTION: In a package, a chip carrier 107 incorporates a heater 109 that is a temperature regulating element and is integrally held with an electric element 103 in a fixing manner. Out of the electric element 103 and the chip carrier 107, only the electric element 103 is fixed to an inner surface of a package container 100 through a fixing part 120. The structure allows a large portion of heat generated by the heater 109 to be effectively provided for temperature regulation of the electric element 103 and thereby significantly reduces leakage of the heat to the package container 100 or an exterior part of the container 100.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016051773(A) |
申请公布日期 |
2016.04.11 |
申请号 |
JP20140175585 |
申请日期 |
2014.08.29 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT>;NTT ELECTORNICS CORP |
发明人 |
SATO NORIO;YAMAGUCHI JOJI;HASHIMOTO ETSU;SUZUKI MASAYA;JIN YOSHITO;EBISAWA FUMIHIRO |
分类号 |
H01S5/024;G02F1/1333;H01L33/48;H01S5/022 |
主分类号 |
H01S5/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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