METHOD FOR FORMING ELECTRODE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a contact electrode of a noble metal which is arranged so that a contact electrode is formed on an organic semiconductor layer by electroless plating, and which never modifies the surface geometry of the organic semiconductor layer during the electroless plating. and lowers a contact resistance between the organic semiconductor layer and the contact electrode to a resistance as low as that achieved by vacuum deposition.SOLUTION: A method for forming a contact electrode on an organic semiconductor layer comprises: a pre-processing step where noble metal nanoparticles are adsorbed on the organic semiconductor layer; and a step where after that, a plated metal is deposited on the noble metal nanoparticles in an electroless plating bath of pH5-9.SELECTED DRAWING: Figure 1