发明名称 COPPER POWDER
摘要 PROBLEM TO BE SOLVED: To provide new copper powder which enables a conductive film and a conductive membrane to be made sufficiently thin and moreover, despite comprising fine particles, enables conductivity to be secured with a small amount.SOLUTION: Provided is copper powder having a chlorine concentration of 5 to 150 wt ppm and a volume cumulative particle diameter D50 of 0.5 to 5.0 μm. Of all copper particles, 80 number% or more are accounted for by copper powder particles exhibiting a dendrite-like structure, where the particle has one main axis from which a plurality of branches extend askew to form a two-dimensionally or three-dimensionally grown dendrite-like structure, and where a number of branches relative to a long diameter L of the main axis, (number of branches)/(long diameter of main axis, L), is 3.0 to 20.0/μm. The copper powder has a specific surface area of 1.2 to 4.0 m/g as measured by a BET one-point method.SELECTED DRAWING: None
申请公布号 JP2016047964(A) 申请公布日期 2016.04.07
申请号 JP20150186520 申请日期 2015.09.24
申请人 MITSUI MINING & SMELTING CO LTD 发明人 MORINAKA HIROYUKI;ODA AKIHIRO
分类号 B22F1/00;C25C1/12;C25C5/02;H01B5/00 主分类号 B22F1/00
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