LIGHT EMITTING ELEMENT PACKAGE AND LIGHT EMITTING DEVICE COMPRISING SAME

摘要

A light emitting element package according to an embodiment comprises: a light emitting element comprising a light emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a package body; a first and second lead frames placed on the package body and electrically spaced apart from each other; a first solder unit in a solid state placed between the first lead frame and the first conductive semiconductor layer and having an equal area and thickness; and a second solder unit in a solid state placed between the second lead frame and the second conductive semiconductor layer and having an equal area and an equal thickness.