WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME

摘要

An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

主权项

1. A method, comprising:
forming a transmissive structure, comprising:
placing a first region of transmissive material and a second region of transmissive material on a first support; andencapsulating the first and second regions of transmissive material with an encapsulant to form a first encapsulating body for said transmissive structure; forming an optical system, comprising:
placing an electromagnetic emitter circuit and an electromagnetic sensor circuit on a second support; andencapsulating the electromagnetic emitter circuit and electromagnetic sensor circuit with an encapsulant to form a second encapsulating body for said optical system; and joining the first encapsulating body to the second encapsulating body such that said first region of transmissive material is aligned with the electromagnetic emitter circuit and said second region of transmissive material is aligned with said electromagnetic sensor circuit.