WAFER INSPECTION METHOD AND WAFER INSPECTION APPARATUS

摘要

A wafer inspection method includes a step of picking up an image of a processed face of a wafer, a step of extracting a pixel having a pixel value higher than those of peripheral pixels as a characteristic point from among pixels in each predetermined region of picked up image data to create a first image, and a step of extracting a pixel having a pixel value lower than those of peripheral pixels as a characteristic point from among the pixels in each predetermined region of the picked up image data to create a second image. The first and second images are used to inspect the processed face of the wafer.

主权项

1. A wafer inspection method for inspecting a processed face of a wafer processed by grinding and polishing, comprising:
an image pickup step of picking up an image of the processed face of a wafer held on a chuck table; and a first image creation step of delimiting picked up image data obtained by the image pickup at the image pickup step for each predetermined region and extracting a pixel having a pixel value higher than those of peripheral pixels as a characteristic point in the predetermined region to create a first image.