发明名称 MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mounting device adaptable to high density mounting, narrow pitch mounting, in-cavity mounting, and the like.SOLUTION: In a mounting unit for mounting an electronic component on a circuit board while holding the electronic component, a mounting nozzle for mounting the electronic component is supported by a shaft extending in a direction perpendicular to the circuit board and capable of moving in that direction and rotating around that direction. The shaft is driven by a voice coil motor, and motion of the shaft in that direction is regulated by a solenoid coil. The shaft is supported by a spline and a bearing at a position closer to a lower end of the shaft than the voice coil motor, when viewed from the solenoid coil.SELECTED DRAWING: Figure 7
申请公布号 JP2016048797(A) 申请公布日期 2016.04.07
申请号 JP20150223697 申请日期 2015.11.16
申请人 TDK CORP 发明人 MIZUNO TORU;SAITO YUJI;MIURA AKIHIKO;IKEDA HIROSHI;MIYAKOSHI TOSHINOBU
分类号 H01L21/60;H01L21/607;H05K13/04 主分类号 H01L21/60
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