发明名称 3D FLEX SOLDERING
摘要 Design requirements can dictate that a portion of a flex assume a bent state during surface mounting and reflow steps. However, traditional assembly line manufacturing processes can be unsuccessful as residual forces generated by the bending can prevent the ends of the bent flex from being maintained in place during surface mounting and reflow operations. One solution is to manipulate paneling that hold batches of the flexes to reliably achieve a suitable bend in the flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.
申请公布号 WO2016053371(A1) 申请公布日期 2016.04.07
申请号 WO2014US70768 申请日期 2014.12.17
申请人 APPLE INC. 发明人 BESEN, RICHARD A.;BATES, ERIC W.;STEPHENS, GREGORY N.
分类号 H05K3/36 主分类号 H05K3/36
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