| 摘要 |
In a process of application of pressure to a layered product 80, firstly, first and second conductive pastes 41 and 51 are caused to adhere to front and back surface patterns 21 and 31 by applying a pressure to the layered product 80 while heating the layered product 80 to a temperature lower than the melting point of a thermoplastic resin thereof, thereby causing elastic deformation of the thermoplastic resin, and further by applying a pressure to the layered product 80 in a direction perpendicular to the layered direction. Secondly, solid phase sintering of the first and second conductive pastes 41 and 51 is caused by applying a pressure to the layered product 80 while heating the layered product 80 to a temperature equal to or higher than the melting point of the thermoplastic resin, thereby fluidizing the thermoplastic resin while causing the thermoplastic resin to flow outwardly, and further by applying a pressure to the layered product 80 in the direction perpendicular to the layered direction. Since the first and second conductive pastes 41 and 51 are thus caused to adhere to the front and back surface patterns 21 and 31, the tendency of fluidization of the first and second conductive pastes 41 and 51 during application of pressure at a temperature equal to or higher than the melting point can be reduced. |
