| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module capable of improving wiring efficiency, and further to provide a wiring board, a manufacturing method of a semiconductor device or the like.SOLUTION: An electronic module 100 includes: a semiconductor device 1 including a semiconductor chip 1a having a plurality of pad openings (pad openings 11A and pad openings 11B), the plurality of pad openings being disposed along four sides of the semiconductor chip 1a and being configured such that parts of the pad openings (pad openings 11A) are formed with solder bumps 12 and the other pad openings (pad opening 11B) are not formed with the solder bumps 12; and a wiring board 20a having wiring 21 being electrically connected to one of the solder bumps 12 and being disposed so as to overlap with the pad openings (pad opening 11B) not formed with the solder bumps 12 in a plan view.SELECTED DRAWING: Figure 1 |
