发明名称 |
PACKAGING AN ARCUATE PLANAR LIGHTWAVE CIRCUIT |
摘要 |
A package for an arcuate planar lightwave circuit (PLC) chip includes a heater plate coupled to a base by a thick and soft support layer. The arcuate PLC is attached to the heater plate by soft adhesive. A hard adhesive is applied to a multi-waveguide end of the arcuate PLC, to additionally strengthen the attachment of the arcuate PLC to the heater plate. The structure allows the mechanical stress due to fiber pull/shock/vibration to be dissipated in the support layer without introducing large wavelength shifts in the arcuate PLC. The support layer also serves as a heat insulator, facilitating uniform heating of the arcuate PLC. |
申请公布号 |
US2016097899(A1) |
申请公布日期 |
2016.04.07 |
申请号 |
US201514967459 |
申请日期 |
2015.12.14 |
申请人 |
Lumentum Operations LLC |
发明人 |
LIN Qingjiu;WANG Wei;MAI Zhihua;WANG Zhongjian |
分类号 |
G02B6/12;G02B6/38;G02B6/30;G02B6/293;G02B6/13 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
1. A PLC module comprising:
a base plate; a support layer on the base plate, the support layer having a thickness greater than 1 mm and a hardness of less than 40 Shore A; a heater plate on the support layer; and a planar lightwave circuit having a shape of an arcuate slab having an input port at a first end thereof, a plurality of output ports at a second opposed end thereof, wherein the planar lightwave circuit is adhered to the heater plate over an area spanning between the first and second ends with a first adhesive having a hardness less than 85 Shore A, and proximate the second end with a second adhesive having a hardness of greater than 70 Shore D. |
地址 |
Milpitas CA US |