| 发明名称 |
MULTI-CHIP PACKAGE, TEST SYSTEM AND METHOD OF OPERATING THE SAME |
| 摘要 |
A multi-chip package includes: a plurality of semiconductor chips that are coupled with each other through normal through silicon vias and repair through silicon vias; a state detection device suitable for detecting connection states of the normal through silicon vias and the repair through silicon vias; and a repair control device suitable for comparing the connection state of the normal through silicon vias with the connection state of the repair through silicon vias, and controlling whether to perform a repair operation. |
| 申请公布号 |
US2016099230(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201514663112 |
申请日期 |
2015.03.19 |
| 申请人 |
SK hynix Inc. |
发明人 |
KANG Yong-Gu;CHO Ho-Sung |
| 分类号 |
H01L25/065;H01L23/48;H01L21/768;G01R31/02;H01L21/66 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multi-chip package comprising:
a plurality of semiconductor chips that are coupled with each other through normal through silicon vias and repair through silicon vias; a state detection device suitable for detecting connection states of the normal through silicon vias and the repair through silicon vias; and a repair control device suitable for comparing the connection states of the normal through silicon vias with the connection states of the repair through silicon vias, and controlling whether to perform a repair operation. |
| 地址 |
Gyeonggi-do KR |
