发明名称 |
SEMICONDUCTOR LASER DEVICE |
摘要 |
In at least one opening of a plurality of openings 10a and 10b, the following inequality is satisfied:;x≦½·t·(kx/ky);where x represents a minimum distance in a horizontal direction between an end of the one opening and an end of a submount 8, and t represents a thickness of the submount, and
in at least one of the other openings different from the one opening, the following inequality is satisfied:;x>½·t·(kx/ky) |
申请公布号 |
US2016099543(A1) |
申请公布日期 |
2016.04.07 |
申请号 |
US201314890084 |
申请日期 |
2013.05.13 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
KURAMOTO Kyosuke;YANAGISAWA Takayuki |
分类号 |
H01S5/022;H01S5/323;H01S5/32;H01S5/024 |
主分类号 |
H01S5/022 |
代理机构 |
|
代理人 |
|
主权项 |
1. A semiconductor laser device, comprising: a submount having a thermal conductivity of kx in a horizontal direction, and a thermal conductivity of ky in a vertical direction that is joined on a heat sink; and a laser element having a plurality of light emitting regions resulting from a plurality of openings for a single laser element, and being mounted on the submount such that a side of the element having an active layer faces a side of the submount, wherein in at least one opening of the plurality of openings, the following inequality is satisfied:
x≦½·t·(kx/ky)where x represents a minimum distance in the horizontal direction between an opening end of the one opening and an end of the submount, and t represents a thickness of the submount, and in at least one of the other openings different from the one opening, the following inequality is satisfied:
x>½·t·(kx/ky) |
地址 |
Tokyo JP |