发明名称 EPOXY RESIN COMPOSITION, COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE
摘要 The present invention provides: an epoxy resin composition containing a curing catalyst of chemical formula 1 and an epoxy resin; a composition for an anisotropic conductive film, containing conductive particles and a binder resin, in addition to the epoxy resin composition; and an anisotropic conductive film formed of the composition for an anisotropic conducive film. An epoxy resin composition which has excellent storage stability while achieving low-temperature fast curing characteristics can be provided by using an ammonium phenolate based curing catalyst represented by chemical formula 1 but excluding a hydroxyl group from an anionic substituent of an aromatic ring compound of the curing catalyst.
申请公布号 WO2016052812(A1) 申请公布日期 2016.04.07
申请号 WO2014KR12180 申请日期 2014.12.11
申请人 SAMSUNG SDI CO., LTD. 发明人 KIM, TAE HO;KANG, KYOUNG HEE;KIM, JUNG SEOB;HEO, GUN YOUNG;KIM, HA NA;CHO, SUNG SEO;HAN, JAE SUN
分类号 C08G59/68;C08G59/20;C08L63/00 主分类号 C08G59/68
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