发明名称 |
EPOXY RESIN COMPOSITION, COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE |
摘要 |
The present invention provides: an epoxy resin composition containing a curing catalyst of chemical formula 1 and an epoxy resin; a composition for an anisotropic conductive film, containing conductive particles and a binder resin, in addition to the epoxy resin composition; and an anisotropic conductive film formed of the composition for an anisotropic conducive film. An epoxy resin composition which has excellent storage stability while achieving low-temperature fast curing characteristics can be provided by using an ammonium phenolate based curing catalyst represented by chemical formula 1 but excluding a hydroxyl group from an anionic substituent of an aromatic ring compound of the curing catalyst. |
申请公布号 |
WO2016052812(A1) |
申请公布日期 |
2016.04.07 |
申请号 |
WO2014KR12180 |
申请日期 |
2014.12.11 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
KIM, TAE HO;KANG, KYOUNG HEE;KIM, JUNG SEOB;HEO, GUN YOUNG;KIM, HA NA;CHO, SUNG SEO;HAN, JAE SUN |
分类号 |
C08G59/68;C08G59/20;C08L63/00 |
主分类号 |
C08G59/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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