POLISHING COMPOSITION, METHOD FOR MANUFACTURING SAME, AND POLISHING METHOD

摘要

Provided is a polishing composition whereby a polishing object such as simple silicon, a silicon compound, or a metal, particularly a polishing object including tungsten, can be polished at a high polishing speed. The polishing composition contains colloidal silica in which an organic acid is immobilized on the surface thereof, hydrogen peroxide, and a salt. The salt is ammonium nitrate and/or ammonium sulfate.