发明名称 SELF-DESTRUCTING CHIP
摘要 PROBLEM TO BE SOLVED: To provide a self-destructing chip including a first die and a second die.SOLUTION: A first die includes an electronic circuit, and a second die is composed of one or more polymers that disintegrate at a first temperature. The second die defines a plurality of chambers, where a first subset of the chambers contains a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contains an etchant for etching materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.SELECTED DRAWING: None
申请公布号 JP2016048538(A) 申请公布日期 2016.04.07
申请号 JP20150059060 申请日期 2015.03.23
申请人 HONEYWELL INTERNATL INC;CORNELL UNIV 发明人 STEVEN TIN;JEFFREY JAMES KRIZ;EICKHOFF STEVEN J;RIDLEY JEFF A;AMIT LAL;CHRISTOPHER OBER;SERHAN ARDANUC;VED GUND;ALEX RUYACK;KATHERINE CAMERA
分类号 G06F21/86;H01L23/00 主分类号 G06F21/86
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