| 摘要 |
In a substrate processing device of the present invention, if there is an inclination defective substrate Wf which is a substrate W that has been determined, by an inclination defect determination part, to have an inclination greater than a preset threshold value, an extraction order changing part changes the order for extracting a plurality of substrates W accommodated within a carrier C from the upper side so as to reverse the order for extracting a substrate W, between the inclination defective substrate Wf and a substrate W that is at least one level above the inclination defective substrate Wf. More specifically, the order is changed so that the inclination defective substrate Wf, the surface of which is in danger of being caught on a hand, is extracted before the substrate W that is one level above. Due to this configuration, damage to a substrate due to scratching of the substrate surface by the hand of a substrate transport mechanism can be prevented. |
