研削装置,申请号JP20120021946-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	研削装置
摘要
申请公布号	JP5898983(B2)	申请公布日期	2016.04.06
申请号	JP20120021946	申请日期	2012.02.03
申请人	株式会社ディスコ	发明人	長縄篤史;輿水準;山中聡;長井修
分类号	B24B47/22;B24B49/10	主分类号	B24B47/22
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Semiconductor device having at least three power terminals superposed on each other

Apparatus and method for custom cosmetic dispensing

Method and device for testing a mat made of biomass particles

Combined wet and dry etching process for micromachining of crystalline materials

Bus bar assembly for use with a compact power conversion assembly

Routing for multilayer ceramic substrates to reduce excessive via depth

Wafer container

Method for controlling machine with control module optimized by improved evolutionary computing

Game method for effecting aging of competing characters independent of game player participation

Quick release mechanical bracket

Methods and apparatus for smoothing text outlines

Dynamic composition of restricted e-learning courses

FUNGICIDAL ACTIVE SUBSTANCE COMBINATIONS CONTAINING TRIFLOXYSTROBIN

COMBINATIONS OF PEROXISOME PROLIFERATOR-ACTIVATED RECEPTOR (PPAR) ACTIVATOR(S) AND STEROL ABSORPTION INHIBITOR(S) AND TREATMENTS FOR VASCULAR INDICATIONS

DUSTING DEVICE WITH MULTIPLE STREAM NOZZLES

VERTICAL SPINDLE PUMP

BEVERAGE CONTAINER CARRIER

A VEHICLE GUARD

2-IMINOPYRROLIDINE DERIVATIVES

PHARMACEUTICAL COMPOSITION COMPRISING ACTIVIN a, aLK-4 OR DERIVATIVES THEREOF FOR THE TREATMENT OF OPHTHALMIC DISEASES