| 摘要 |
The method involves forming a silicon substrate including an electrically conductive top surface. A mold is structured from photosensitive resin to form cavities with a base formed by the electrically conductive top surface by depositing a photosensitive resin layer on the conductive top surface. The cavities of the mold are filled by galvanoplasty to form a metal part (21). A portion of the metal part is selectively machined to form a single-piece micromechanical component having distinct functional levels. The component is released from the substrate and the photosensitive resin. The metal part is formed from a nickel phosphorus base. An independent claim is also included for a timepiece. |
