Semiconductor chip

摘要

A sensor chip comprises a substrate (1) and a stack (2) of insulating layers arranged on the substrate. In a centre area (CA) of the sensor chip a sensing element (3) is arranged, as well as a circuit (21) in the stack (2) for electrically connecting the sensing element (3). Between the centre area (CA) and an edge (ED) of the sensor chip a seal ring (SR) and an optical inspection area (OI) are provided. The technique can also be applied with other types of semiconductor chips.