发明名称 化合物半導体装置及びその製造方法
摘要 <P>PROBLEM TO BE SOLVED: To achieve a highly-reliable MIS compound semiconductor device which can obtain assured normally-off by a comparatively simple configuration by employing a recessed gate structure. <P>SOLUTION: A compound semiconductor device comprises: a compound semiconductor lamination structure 2 formed on a Si substrate 1 and including an electron supply layer 2d, an electron transit layer 2c formed under the electron supply layer 2d and in which a two-dimensional electron gas is generated at a boundary with the electron supply layer 2d, and a channel layer 2b formed under the electron transit layer 2c and composed of a material having polarization larger than that of the electron transit layer 2c; and a gate electrode 5 filling via a gate insulation film 4, a groove 10A reaching the channel layer 2b formed in the compound semiconductor lamination structure 2. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5899879(B2) 申请公布日期 2016.04.06
申请号 JP20110266206 申请日期 2011.12.05
申请人 富士通セミコンダクター株式会社 发明人 薄島 章弘;佐藤 成生
分类号 H01L21/338;H01L21/28;H01L21/336;H01L29/06;H01L29/41;H01L29/423;H01L29/49;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
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