Adhesion promoting adducts containing metal ligands, compositions thereof, and uses thereof

摘要

Disclosed are adhesion promoting adducts containing adhesion promoting groups and metal ligands and compositions such as sealant compositions useful in aerospace applications comprising the adhesion promoting adducts. The adhesion promoting adducts are useful as adhesion promoting additives or as a copolymerizable reactant in polymer compositions.

主权项

1. An adhesion promoting adduct having a structure of Formula (13):
R11—P—R12′—R13′-M-R14  (13) wherein,
R11 comprises an adhesion promoting group;P comprises a core of an adhesion promoter R11—P—R12;M comprises a metal ligand, wherein the metal ligand comprises a moiety of Formula (12a), Formula (12b), Formula (12c), Formula (12d), Formula (12e), or a combination of any of the foregoing:
—X—(CH2)n—CH(—OH)—  (12a)—X—(CH2)n—CH(—OH)—(CH2)n—X—  (12b)—CH(—OH)—(CH2)n—X—(CH2)n—CH(—OH)—  (12c)—CH(—OH)—R5—CH(—OH)—  (12d)—C(O)—R5—C(O)—  (12e)wherein,
each X is independently selected from —C(O)— and —S(O)2—,n is an integer from 1 to 3; andR5 is C1-4 alkanediyl;R12′ and R13′ represent moieties derived from the reaction of R12 and R13 of the adhesion promoter R11—P—R12 and a metal chelating agent R13-M-R14, wherein R12 and R13 comprise mutually reactive functional groups, andR14 comprises a reactive functional group selected from a thiol group, an epoxy group, an isocyanate group, an alkenyl group, and a Michael acceptor group.