发明名称 Semiconductor device and memory device
摘要 A semiconductor device includes a substrate, a controller chip, and memory chips. Wiring is formed on the substrate. The controller chip has a rectangular surface area, and is mounted on the substrate. The memory chips have quadrangular surface areas, and are superposed on the substrate on a first major side of the controller chip. The first major side defines a first direction and a first controller terminal block is formed along a first minor side thereof orthogonal to the first direction, and a second controller terminal block is formed along a second major side opposite to the first major side.
申请公布号 US9305900(B2) 申请公布日期 2016.04.05
申请号 US201414194398 申请日期 2014.02.28
申请人 Kabushiki Kaisha Toshiba 发明人 Iwamoto Masaji
分类号 H01L25/065 主分类号 H01L25/065
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. A semiconductor device comprising: a substrate having wiring formed thereon; a controller chip having a rectangular shape in plan view mounted on the substrate so that a first major surface is opposite to the substrate; and a plurality of memory chips having a quadrangular shape in plan view sequentially stacked on the substrate, wherein a first direction is defined along a first major side of the controller chip in plan view, and a first controller terminal block is formed on the first major surface of the controller chip along a first minor side of the controller chip in a direction orthogonal to the first direction, and a second controller terminal block is formed on the first major surface of the controller chip along a second major side opposite to the first major side, and wherein the plurality of memory chips include a first memory chip having a first memory terminal block formed along one side thereof that is orthogonal to the first direction, and a second memory chip having a second memory terminal block formed along one side thereof that is orthogonal to the first direction, the first memory chip and the controller chip are electrically connected through the first memory terminal block and the first controller terminal block by the wiring, and the second memory chip and the controller chip are electrically connected through the second memory terminal block and the second controller terminal block by the wiring.
地址 Tokyo JP