SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATMENT METHOD

摘要

Provided are a substrate treating apparatus and a substrate treating method, which are capable of accurately detecting a discharge of treatment solution from a nozzle. An upper treatment solution nozzle (30) discharges a treatment solution at a treatment position above a substrate (W). A reference image (SA) and a test image (PA) are cut out from one sheet of an image (FA) captured after the upper treatment solution nozzle (30) receives an instruction to start discharging the treatment solution. The test image (PA) is an image including an area of a surface of the substrate (W), in which a liquid flow of the treatment solution from the upper treatment solution nozzle (30) is to be formed. The reference image (SA) is an image of an area of the surface of the substrate (W) except for the area in which the liquid flow of the treatment solution from the upper treatment solution nozzle (30) is to be formed. Through the comparison between the reference image (SA) and the test image (PA), a discharge of the treatment solution from the upper treatment solution nozzle (30) is determined.