METHOD OF MANUFACTURING THROUGH-ELECTRODE SUBSTRATE, PRESSURE SENSITIVE ADHESIVE SHEET AND ELECTROLYTIC PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To simplify a step that uses electrolytic plating processing.SOLUTION: A method of manufacturing a through-electrode substrate includes: disposing a pressure sensitive adhesive layer which is conductive and of which the pressure sensitive adhesive strength is reduced by applying stimulation thereto, and a second substrate that supports a first substrate via the pressure sensitive adhesive layer, on a first surface of a first substrate in which a bottomed hole open to the first surface side is disposed; forming a through-hole formed by thinning the first substrate from a second surface that confronts the first surface, thereby opening a bottom of the bottomed hole; growing a conductive layer from the pressure sensitive adhesive layer to the through-hole by the electrolytic plating processing in which a current is supplied via the pressure sensitive adhesive layer; applying the stimulation to the pressure sensitive adhesive layer; and peeling the pressure sensitive adhesive layer and the second substrate from the first substrate.SELECTED DRAWING: Figure 4