| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for: improving heat release property of an LED package by increasing conductivity and thermal conductivity of a lead frame composed of a Cu-Fe-based copper alloy plate and strip; and achieving high luminance of the LED package by increasing reflectance of an Ag-plated reflection film formed on a surface of the lead frame.SOLUTION: There is provided Cu-Fe-based copper alloy plate and strip which contain Fe:0.01 to 0.5 mass%, P:0.01 to 0.20 mass%, Zn:0.01 to 1.0 mass%, Sn:0.01 to 0.15 mass% and the balance substantially Cu with inevitable impurities, and in which surface roughness Ra in a direction perpendicular to a rolling direction is less than 0.06 μm expressed as arithmetic average roughness and surface roughness Rzis less than 0.5 μm expressed as ten-point average roughness, and the number of groove-shaped recesses present in a surface and having a length of 5 μm or more and a depth of 0.25 μm or more is 2 or less per area of square of 200 μm×200 μm and thickness of an affected layer composed of fine crystal of the surface is 0.5 μm or less.SELECTED DRAWING: Figure 1 |
