发明名称 THERMAL ANALYSIS DEVICE AND THERMAL ANALYSIS METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thermal analysis device capable of performing a highly accurate TG-DSC measurement without using complicated measurement procedures.SOLUTION: A thermal analysis device according to the present invention includes: a pair of specimen container assembly groups composed of a first specimen container assembly group 101 and a second specimen container assembly group 102 connecting a specimen container and a heat sink by a member having a predetermined thermal resistance; a heating part 20 for equally heating the pair of specimen container assembly groups; a temperature control part 400 for controlling a temperature of the heating part; a weight measurement part 103 for measuring a weight difference between a specimen mounted on a specimen container 9 of a first specimen container assembly and a reference material mounted on a specimen container 10 of a second specimen container assembly; and a temperature measurement part 300 for measuring a temperature difference between the specimen and the reference material. The measurement of the weight difference and the temperature difference are performed, while changing the temperature of the heating part by the temperature control part.SELECTED DRAWING: Figure 1
申请公布号 JP2016045086(A) 申请公布日期 2016.04.04
申请号 JP20140169762 申请日期 2014.08.22
申请人 NETZSCH GERAETEBAU GMBH 发明人 KINOSHITA RYOICHI;SHINODA YOSHIO
分类号 G01N25/20;G01N5/04 主分类号 G01N25/20
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