| 摘要 |
PROBLEM TO BE SOLVED: To disclose a coreless package substrate having a both sides solder resist layer.SOLUTION: A coreless package substrate includes a single build-up structure having a top face and a bottom face on the opposite side thereof, and formed of at least one insulation layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a plurality of bottom contact pads on the bottom face, and a plurality of top contact pads on the top face. A bottom solder resist layer exists on the bottom face, and a top solder resist layer exists on the top face. The concept of both side solder resist is expanded to a package including an interconnect bridge having a C4 interconnection pitch of wide range.SELECTED DRAWING: Figure 1A |
