| 发明名称 |
HIGH RESISTIVITY MATERIAL-BASED PACKAGING ELEMENT FOR ELECTRIC FIELD SENSOR |
| 摘要 |
A high resistivity material-based packaging element for an electric field sensor comprises: a substrate; a first packaging frame fixed to the substrate; and a first packaging cover fixed to the packaging frame; wherein at least one electric field sensor chip is located in an inner cavity formed by the substrate, the first packaging frame, and the first packaging cover, and at least one of the substrate, the first packaging frame, and the first packaging cover is of a high resistivity material having an electrical resistivity equal to or greater than 108Ω·cm. The present invention can ensure accurate measurement of the electric field, and provide an approach to solve the problem of environmental adaptability, thereby enhancing the stability and reliability of electric field detection. |
| 申请公布号 |
US2016091546(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201414787851 |
申请日期 |
2014.08.05 |
| 申请人 |
INSTITUTE OF ELECTRONICS CHINESE ACADEMY OF SCIENCES |
发明人 |
XIA Shanhong;WEN Xiaolong;CHEN Xianxiang;PENG Chunrong;YANG Pengfei;FANG Dongming |
| 分类号 |
G01R29/12;H05K1/18 |
主分类号 |
G01R29/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A high resistivity material-based packaging element for an electric field sensor, comprising:
a substrate; a first packaging frame fixed to the substrate; and a first packaging cover fixed to the packaging frame; wherein, at least one electric field sensor chip is located in an inner cavity formed by the substrate, the first packaging frame, and the first packaging cover, and at least one of the substrate, the first packaging frame, and the first packaging cover is of a high resistivity material having an electrical resistivity equal to or greater than 108Ω·cm. |
| 地址 |
Beijing CN |
