发明名称 FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND METHODS THEREOF
摘要 A packaged RF device is provided that can provide improved performance and flexibility though the use of flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.
申请公布号 US2016093587(A1) 申请公布日期 2016.03.31
申请号 US201414500319 申请日期 2014.09.29
申请人 Freescale Semiconductor, Inc. 发明人 VISWANATHAN Lakshminarayan;WATTS Michael E.
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A radio-frequency (RF) device comprising: at least one integrated circuit (IC) die configured to implement the RF device; a package containing the at least one IC die; and a flexible circuit lead coupled to the at least one IC die inside the package and extending to outside the package, the flexible circuit lead comprising at least one flexible base layer and at least one conductor, the flexible circuit lead providing an electrical connection to the at least one IC die.
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