| 摘要 |
PROVIDED IS A MULTILAYER ADHESIVE SHEET WHICH ENABLES EASY SEPARATION BETWEEN AN ADHESIVE LAYER AND A DIE ATTACH FILM DURING THE PICK-UP EVEN IN CASES WHERE AN ACRYLATE ESTER COPOLYMER IS USED IN THE DIE ATTACH FILM, THEREBY MAKING THE PICK-UP WORK OF SEMICONDUCTOR CHIPS AFTER THE DICING EASY. THE MULTILAYER ADHESIVE SHEET COMPRISES A BASE FILM, AN ADHESIVE LAYER THAT IS DISPOSED ON ONE SURFACE OF THE BASE FILM, AND A DIE ATTACH FILM THAT IS DISPOSED ON AN EXPOSED SURFACE OF THE ADHESIVE LAYER. THE ADHESIVE THAT CONSTITUTES THE ADHESIVE LAYER CONTAINS: (A) A (METH)ACRYLATE ESTER COPOLYMER; (B) AN ULTRAVIOLET POLYMERIZABLE COMPOUND; (C) A MULTIFUNCTIONAL ISOCYANATE DURING AGENT; (D) A PHOTOPOLYMERIZATION INITIATOR; AND (E) A SILICONE POLYMER. |
