发明名称 |
SOLDER COATING BALL, AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a fine solder coating ball excellent in mass productivity.SOLUTION: A solder coating ball 10A comprises: a spherical core 11 containing Ni and P; and a solder layer 12 formed to cover the core 11. A solder coating ball 10B further comprises a Cu plated layer 13 formed between the core 11 and the solder layer 12. A solder coating ball 10C further comprises a Ni plated layer 14 formed between the Cu plated layer 13 and the solder layer 12.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016041439(A) |
申请公布日期 |
2016.03.31 |
申请号 |
JP20140166137 |
申请日期 |
2014.08.18 |
申请人 |
HITACHI METALS LTD |
发明人 |
NOSAKA TSUTOMU;MORI HIDETO |
分类号 |
B23K35/14;B22F1/00;B22F1/02;B22F9/24;B23K35/26;C22C13/00;C22C19/03 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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