发明名称 SOLDER COATING BALL, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a fine solder coating ball excellent in mass productivity.SOLUTION: A solder coating ball 10A comprises: a spherical core 11 containing Ni and P; and a solder layer 12 formed to cover the core 11. A solder coating ball 10B further comprises a Cu plated layer 13 formed between the core 11 and the solder layer 12. A solder coating ball 10C further comprises a Ni plated layer 14 formed between the Cu plated layer 13 and the solder layer 12.SELECTED DRAWING: Figure 1
申请公布号 JP2016041439(A) 申请公布日期 2016.03.31
申请号 JP20140166137 申请日期 2014.08.18
申请人 HITACHI METALS LTD 发明人 NOSAKA TSUTOMU;MORI HIDETO
分类号 B23K35/14;B22F1/00;B22F1/02;B22F9/24;B23K35/26;C22C13/00;C22C19/03 主分类号 B23K35/14
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