发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME |
摘要 |
Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate and electrically connected to the package substrate; a first protective layer covering the semiconductor chip and having flexibility controlled by at least one of a material type, a thickness, a material composition ratio and viscosity of the first protective layer; and a second protective layer arranged on the first protective layer and having flexibility controlled by at least one of a material type and a thickness of the second protective layer, wherein the first protective layer comprises a first binder resin, a first hardener, and a first hardening catalyst. According to the semiconductor package of the inventive concept, protective layers protecting the semiconductor chip have flexibility, and thus, the semiconductor package may be bent. |
申请公布号 |
US2016093545(A1) |
申请公布日期 |
2016.03.31 |
申请号 |
US201514723976 |
申请日期 |
2015.05.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE Cheol-woo;LEE Kang Soo;HWANG Hyeon |
分类号 |
H01L23/06;H01L21/56;H01L21/52;H01L23/482 |
主分类号 |
H01L23/06 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor package comprising:
a package substrate; a semiconductor chip mounted on the package substrate and electrically connected to the package substrate; a first protective layer covering the semiconductor chip and having flexibility controlled by at least one of a material type, a thickness, a material composition ratio and viscosity of the first protective layer; and a second protective layer arranged on the first protective layer and having flexibility controlled by at least one of a material type and a thickness of the second protective layer, wherein the first protective layer comprises a first binder resin, a first hardener and a first hardening catalyst. |
地址 |
Suwon-si KR |