MANAGING HEAT TRANSFER FOR ELECTRONIC DEVICES

摘要

An apparatus for cooling a heat-producing electronic device is disclosed. The apparatus may include a thermally conductive vessel to mate with and contain a working fluid in contact with the heat-producing electronic device. A bottom side of the thermally conductive vessel may include a sealing surface defining an aperture and configured to mate with, and inside a perimeter of, a top surface of the heat-producing electronic device. The thermally conductive vessel may also include an evaporative cavity formed by mating the thermally conductive vessel with the heat-producing electronic device, and having a wall that is the top surface of the heat-producing electronic device and a wall that is an interior surface of the thermally conductive vessel. The thermally conductive vessel may also include a condensing cavity adjoining the evaporative cavity, to receive heat by condensing the working fluid from a vapor state to a liquid state.

主权项

1. An apparatus for cooling a heat-producing electronic device, comprising:
a thermally conductive vessel configured to, when mated with the heat-producing electronic device, contain a working fluid in contact with the heat-producing electronic device, the vessel having:
a sealing surface, on a bottom side of the thermally conductive vessel, that defines an aperture and that is configured to mate with an inside a perimeter of a top surface of the heat-producing electronic device;a wall that is an interior surface of the thermally conductive vessel and that is configured to form an evaporative cavity when mated with the heat-producing electronic device, andat least one condensing cavity adjoining the evaporative cavity and configured to, when the thermally conductive vessel is mated to the heat-producing electronic device, cool the working fluid by condensing the working fluid from a vapor state to a liquid state.