| 发明名称 |
CIRCUIT BOARD |
| 摘要 |
Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape. |
| 申请公布号 |
US2016095203(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514870572 |
申请日期 |
2015.09.30 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
MIN Tae Hong;KANG Myung Sam;KO Young Gwan;SEONG Min Jae;JANG Jin Hyuk |
| 分类号 |
H05K1/02;H05K1/14;H05K1/18;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising a first heat transfer structure formed of a thermal conductive material, wherein at least a part of the first heat transfer structure is inserted into an insulation unit and another part thereof is exposed to outside of the insulation unit. |
| 地址 |
Suwon-Si KR |
