发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device using an oxide semiconductor, capable of achieving higher reliability by imparting with stable electrical characteristics.SOLUTION: An oxide semiconductor film serving as a channel formation region of a transistor is formed by a sputtering method at a temperature higher than 200°C, so that the number of water molecules eliminated from the oxide semiconductor film can be 0.5/nmor less in thermal desorption spectroscopy. A substance including a hydrogen atom such as hydrogen, water, a hydroxyl group, or hydride which causes variation in the electric characteristics of a transistor using an oxide semiconductor is prevented from entering the oxide semiconductor film, and thereby the oxide semiconductor film can be highly purified and made to be an electrically i-type (intrinsic) semiconductor.SELECTED DRAWING: Figure 1
申请公布号 JP2016042584(A) 申请公布日期 2016.03.31
申请号 JP20150207665 申请日期 2015.10.22
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;SASAKI TOSHINARI;NODA KOSEI
分类号 H01L21/336;H01L21/363;H01L29/786;H01L51/50;H05B33/14 主分类号 H01L21/336
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